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(Standard Leadtime :6 Weeks) 31

Quantity Price
1 13.82000
10 12.25000
25 11.77920
50 11.30800
100 10.67970
250 9.73740
500 9.10920
1000 8.35533

1 10 100 1000 2500 Updated
* 110957-HMC453ST89 7470 USD
* 110959-0002 0 USD
* 110959-0042 0 USD
* 11095-2 0 231.24000
* 11095-1 0
* 1109522 2502 USD
* 1109523 6132 USD
* 110959-0042 0 USD
* 11095.0 0
* 110959-0000 0
* 110959-0002 0
* 110959-0004 0
* 110959-0011 0
* 110959-0015 0
* 110959-0035 0
* 110959-0036 0
* 110959-0038 0
* 110959-0042 0
* 110959-0043 0
* 1109522 0
* 110957-HMC453ST89 0 USD 507.66000
* 11095 0 USD 29.39000
* 110957-HMC453ST89 17 USD 580.1857 548.8243
* 1109522 0 USD
* 1109523 0 USD
* 110957-HMC453ST89 0 USD
* 110957-HMC453ST89 0 USD
* 110959-0002 1 USD
* 11095-2 1 USD
* 11095-1 Please Inquiry USD
* 1109565 Please Inquiry USD
* 110959-0042 Please Inquiry USD
* 110957-HMC453ST89 1 USD

TYPEDESCRIPTION
MfrAries Electronics
SeriesCorrect-A-Chip® 1109523
PackageBulk
Product StatusActive
Convert From (Adapter End)DIP, 0.3" (7.62mm) Row Spacing
Convert To (Adapter End)JEDEC
Number of Pins8
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Mounting TypeThrough Hole
TerminationSolder
Pitch - Post-
Contact Finish - PostTin-Lead
Housing MaterialPolyamide (PA46), Nylon 4/6, Glass Filled
Board MaterialFR4 Epoxy Glass
Termination Post Length0.125" (3.18mm)
Material Flammability RatingUL94 V-0
FeaturesSocket Included
Current Rating (Amps)1 A
Operating Temperature-
Contact Material - MatingBeryllium Copper
Contact Material - PostBrass
Contact Finish Thickness - Mating10.0µin (0.25µm)
Contact Finish Thickness - Post200.0µin (5.08µm)
Base Product Number1109523


Aries Electronics
SOCKET ADAPTER DIP TO TO-8
IC Socket Adapter DIP, 0.3" (7.62mm) Row Spacing To JEDEC Through Hole