TE Connectivity’s (TE) Octal Small Form Factor Pluggable (OSFP) Connectors, Cages and Cable Assemblies meets the needs of next-generation data centers by supporting aggregate data rates of 200 Gbps, and up to 400 Gbps. The products are designed for both 28G NRZ and 56G PAM-4 protocols, with a roadmap to 112G PAM-4 for future system upgrades. The plugs utilize integrated thermal heatsink technology to offer superior thermal performance and the signal integrity needed to support 400G data rates. OSFP products offer high port density and can fit up to 36 ports of an 8 lane interface in a 1RU switch form factor, aligning with current and next-generation silicon roadmaps.
