Exceptionally low plating load of 4.0pF, ideal for wearables,
wireless, and IoT applications
Simultaneously optimized for ESR over extended operating
temperature range
Miniature 1.6 x 1.0 x 0.5 mm SMD package, ideally suited
for space constrained designs
Available with ±20 ppm set tolerance
Seam sealed package for long term reliability
Applications
Wearables
Wireless Modules
Internet of Things (IoT)
Bluetooth/Bluetooth Low Energy (BLE)
Machine-to-Machine (M2M) Connectivity
Ultra Low Power MCU
Near Field Communication (NFC)
ISM Band Applications
Ultra low power, energy saving MCU